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Merge "[eSE] Update AIDL secure_element for eSE1" into udc-d1-dev am: bd601d358c

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Original change: https://googleplex-android-review.googlesource.com/c/device/google/shusky/+/22606870

Change-Id: I37c9597c49b0441c5e06af93596ee189a24e39fa
Signed-off-by: Automerger Merge Worker <android-build-automerger-merge-worker@system.gserviceaccount.com>
This commit is contained in:
Treehugger Robot 2023-04-14 01:54:41 +00:00 • committed by Automerger Merge Worker
commit 49ce2bdb51
4 changed files with 3 additions and 19 deletions
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5
device-husky.mk
View file

@ -75,16 +75,13 @@ PRODUCT_PACKAGES += \
# SecureElement
PRODUCT_PACKAGES += \
android.hardware.secure_element@1.2-service-gto
android.hardware.secure_element-service.thales
PRODUCT_COPY_FILES += \
frameworks/native/data/etc/android.hardware.se.omapi.ese.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.hardware.se.omapi.ese.xml \
frameworks/native/data/etc/android.hardware.se.omapi.uicc.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.hardware.se.omapi.uicc.xml \
device/google/shusky/nfc/libse-gto-hal.conf:$(TARGET_COPY_OUT_VENDOR)/etc/libse-gto-hal.conf
DEVICE_MANIFEST_FILE += \
device/google/shusky/nfc/manifest_se.xml
# Thermal Config
PRODUCT_COPY_FILES += \
device/google/shusky/thermal_info_config_husky.json:$(TARGET_COPY_OUT_VENDOR)/etc/thermal_info_config.json \

5
device-ripcurrent.mk
View file

@ -67,16 +67,13 @@ PRODUCT_PACKAGES += \
# SecureElement
PRODUCT_PACKAGES += \
android.hardware.secure_element@1.2-service-gto
android.hardware.secure_element-service.thales
PRODUCT_COPY_FILES += \
frameworks/native/data/etc/android.hardware.se.omapi.ese.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.hardware.se.omapi.ese.xml \
frameworks/native/data/etc/android.hardware.se.omapi.uicc.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.hardware.se.omapi.uicc.xml \
device/google/shusky/nfc/libse-gto-hal-disable.conf:$(TARGET_COPY_OUT_VENDOR)/etc/libse-gto-hal.conf
DEVICE_MANIFEST_FILE += \
device/google/shusky/nfc/manifest_se.xml
# Thermal Config
PRODUCT_COPY_FILES += \
device/google/shusky/thermal_info_config_ripcurrent.json:$(TARGET_COPY_OUT_VENDOR)/etc/thermal_info_config.json \

5
device-shiba.mk
View file

@ -66,16 +66,13 @@ PRODUCT_PACKAGES += \
# SecureElement
PRODUCT_PACKAGES += \
android.hardware.secure_element@1.2-service-gto
android.hardware.secure_element-service.thales
PRODUCT_COPY_FILES += \
frameworks/native/data/etc/android.hardware.se.omapi.ese.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.hardware.se.omapi.ese.xml \
frameworks/native/data/etc/android.hardware.se.omapi.uicc.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.hardware.se.omapi.uicc.xml \
device/google/shusky/nfc/libse-gto-hal.conf:$(TARGET_COPY_OUT_VENDOR)/etc/libse-gto-hal.conf
DEVICE_MANIFEST_FILE += \
device/google/shusky/nfc/manifest_se.xml
# Thermal Config
PRODUCT_COPY_FILES += \
device/google/shusky/thermal_info_config_shiba.json:$(TARGET_COPY_OUT_VENDOR)/etc/thermal_info_config.json \

7
nfc/manifest_se.xml
View file

@ -1,7 +0,0 @@
<manifest version="1.0" type="device">
<hal format="hidl">
<name>android.hardware.secure_element</name>
<transport>hwbinder</transport>
<fqname>@1.2::ISecureElement/eSE1</fqname>
</hal>
</manifest>